Semiconductor device and method of manufacturing the semiconductor device

ABSTRACT

A semiconductor device in which MRAM is formed in a wiring layer A contained in a multilayered wiring layer, the MRAM having at least two first magnetization pinning layers in contact with a first wiring formed in a wiring layer and insulated from each other, a free magnetization layer overlapping the two first magnetization pinning layers in a plan view, and connected with the first magnetization pinning layers, a non-magnetic layer situated over the free magnetization layer, and a second magnetization pinning layer situated over the non-magnetic layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

The disclosure of Japanese Patent Application No. 2011-49236 filed onMar. 7, 2011 including the specification, drawings, and abstract isincorporated herein by reference in its entirety.

BACKGROUND

The present invention concerns a semiconductor device and a method ofmanufacturing the semiconductor device.

For example, International Laid-Open Publication WO2009-001706 disclosesa magnetoresistive random access memory (MRAM) utilizing a currentdriven magnetic domain wall motion.

FIG. 12 shows a configuration of an MRAM disclosed in InternationalLaid-Open Publication WO2009-001706. The MRAM has first magnetizationpinning layers 5 a, 5 b, a second magnetization pinning layer 6, anon-magnetic layer 4, and a free magnetization layer. The freemagnetization layer has a magnetization pinned regions 1 a, 1 b, amagnetic domain wall moving region 3, and magnetic domain wall pinningsites 2 a, 2 b. The second magnetization pinning layer 6 is disposed soas to overlap at least a portion of the magnetic domain wall movingregion. Each of the free magnetization layer, the first magnetizationpinned layers 5 a, 5 b, and the second magnetization pinning layer 6comprises a ferromagnetic material and shows magnetization indicated bythe direction of arrows. That is, the first magnetization pinning layers5 a, 5 b have pinning magnetization anti-parallel to each other, and thesecond magnetization pinning layer 6 has pinning magnetization inparallel to the first magnetization pinning layer 5 a or 5 b.

The magnetic domain wall moving region 3 of the free magnetization layercan be optionally switched for magnetization in accordance with writingof current and serves for writing information. The magnetization pinnedregions 1 a, 1 b of the free magnetization layer are disposed inadjacent with the first magnetization pinning layers 5 a, 5 b by whichthe magnetization pinned regions 1 a and 1 b have magnetizationanti-parallel to each other.

Further, a magnetic domain wall is formed to the magnetic domain wallpinning site 2 a or 2 b in accordance with the direction ofmagnetization of the magnetic domain wall moving region. The magneticwall pinning site has a function of stably fixing the magnetic domainwall when a magnetic field or current is not applied. It has beentheoretically found that the magnetic domain wall pinning sites 2 a, 2 bin the free magnetization layer can spontaneously fix the magneticdomain wall with no provision of particular structure.

Japanese Unexamined Patent Application Publication No. 2003-174149discloses the structure of magnetoresistive random access memory (MRAM)suitable to refinement and integration.

The MRAM comprises a cylindrical first magnetic body capable of changingthe magnetization direction and opened at one end and a columnar secondmagnetic body fixed in one peripheral direction for the direction ofmagnetization and formed in the cylinder of the first magnetic body byway of an insulating layer. A rotating magnetic field is generated byflowing a tunnel current between the first and second magnetic bodies toset the direction of magnetization of the first magnetic body to one oranother peripheral direction, and utilize the change of the magneticresistance depending on the direction of magnetization of the firstmagnetic body to the direction of magnetization of the second magneticbody as binary signals.

Japanese Unexamined Patent Application Publication No. 2009-224477discloses a magnetic memory unit having an MRAM and a manufacturingmethod thereof.

Specifically, it relates to a structure of an MRAM containing amagnetization pinning layer, a non-magnetic spacer layer formed over themagnetization pinning layer, and a free magnetization layer formed overthe non-magnetic spacer layer in which the magnetization pinning layerand the free magnetization layer are adjacent to each other with anon-magnetic spacer layer being interposed therebetween in a deviceregion of the magnetization pinning layer except for the peripheralportion, and the magnetization pinning layer and the free magnetizationlayer are spaced apart on the peripheral portion of the magnetizationfixing layer.

SUMMARY

In recent years, Foundry development has been promoted in the advancedLSI production and it has been demanded to obtain a hybridized MRAM on acommon logic IP (Intellectual Property). When the MRAM is formed in awiring layer, it is necessary that the process for forming amultilayered wiring for LSI does not fluctuate characteristics of theMRAM and the process for forming the MRAM does not fluctuatecharacteristics of the multilayered wiring.

FIG. 13 shows a drawing disclosed in International Laid-Open PublicationWO2009-001706. The drawing shows an example of forming the MRAMdisclosed in FIG. 12 in a multilayered wiring layer. Specifically, anMRAM is formed over a contact 8 formed over a lower layer wiring 9. Inthe example shown in the drawing, the height of the contact 7 in aregion where the MRAM is not situated is higher than the height of acontact in other layer in the layer in which the MRAM is introduced.That is, the presence of the MRAM gives an effect on the multilayeredwiring structure.

When the height of the contact 7 is large, since a metal material isdifficult to be buried and, in addition, parameters of resistance andcapacitance of the wiring are different from those of usual logic IP,this results in a problem of additionally requiring, construction ofdesign circumstance.

The techniques described in Japanese Unexamined Patent ApplicationPublication No. 2003-174149 and Japanese Unexamined Patent ApplicationPublication No. 2009-224477 relate to an MRAM of a device structuredifferent from that of the magnetic domain wall moving type MRAM.

According to one aspect of the present invention, there is provided asemiconductor device having a multilayered wiring layer formed over asubstrate, in which a first layer contained in the multilayered wiringlayer has a first interlayer insulating film, a plurality of first viaholes buried in the first interlayer insulating film, and a plurality offirst wirings buried in the first interlayer insulating film connectedwith the first via holes and exposed at the surface from the firstinterlayer insulating film, and a second layer contained in themultilayered wiring layer and situated just over the first layer has, ina second region, an MRAM having at least two first magnetization pinninglayers in contact with the first wiring and insulated from each other, afree magnetization layer overlapping the two first magnetization pinninglayer in a plan view and connected with the first magnetization pinninglayers, a non-magnetic layer situated over the free magnetization layer,and a second magnetization pinning layers situated over the non-magneticlayer, a second interlayer insulating film covering the MRAM, a secondvia hole buried in the second interlayer insulating film and connectedwith the second magnetization pinning layers, and a second wiring buriedin the second interlayer insulating film, connected with the second viahole, and exposed at the surface from the second interlayer insulatingfilm.

According to another aspect of the present invention, there is provideda method of manufacturing a semiconductor device including: a first stepof forming a first interlayer insulating film over a substrate and thenburying a plurality of first via holes and first wirings in the firstinterlayer insulating film so as to expose the first wirings therebyforming a first layer; a second step of forming at least two firstmagnetization pinning layers electrically insulated from each other overthe first wiring in a first region over the first layer; a third step ofcompleting an MRAM by forming a free magnetization layer overlapping thetwo first magnetization pinning layers in a plan view, and electricallyconnected with the first magnetization pinning layers, a non-magneticlayer situated over the free magnetization layer, and a secondmagnetization pinning layers situated over the non-magnetic layer; afourth step of forming a second interlayer insulating film covering theMRAM; and a fifth step of burying a second via hole connected with thesecond magnetization pinning layer and a second wiring connected withthe second via hole in the second interlayer insulating film.

In the present the invention, MRAM is formed in contact with the wiringsin the lower layer. That is, in the present invention, the contact (orvia hole) is not situated between the wiring in the lower layer and theMRAM different from the existent technique shown in FIG. 13. Accordingto the invention, since the thickness of the layer in which the MRAM isformed can be reduced by so much as the contact (or via hole) is notintervened, the height of the layer can be made identical with theheight of the layer in which the MRAM is not formed. In this case, theheight of the wiring and that of the via hole formed in each of thelayer can also be made identical. As a result, this can avoid adisadvantage that the multilayered wiring structure on the side of thelogic is changed due to the MRAM formed in the multilayered wiringlayer.

The invention can decrease or mitigate the disadvantage in the logichybridized MRAM that the process for forming the multilayered wiring ofLSI fluctuates the characteristic of the MRAM and a disadvantage thatthe process for forming MRAM changes the characteristic of themultilayered wirings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows an example of a cross sectional view of a semiconductordevice according to a preferred embodiment;

FIG. 2 shows an example of a cross sectional view of a semiconductordevice according to a preferred embodiment;

FIG. 3A to FIG. 3F show an example of a manufacturing flow chart of asemiconductor device of this embodiment;

FIG. 4G to FIG. 4L show an example of a manufacturing flow chart of asemiconductor device of this embodiment;

FIG. 5M to FIG. 5P show an example of a manufacturing flow chart of asemiconductor device of this embodiment;

FIG. 6Q to FIG. 6S show an example of a manufacturing flow chart of asemiconductor device of this embodiment;

FIG. 7A and FIG. 7B show an example of cross sectional views of thesemiconductor device of this embodiment;

FIG. 8A to FIG. 8C show an example of a manufacturing flow chart of thesemiconductor device of this embodiment;

FIG. 9 is a graph explaining the function and the effect of thesemiconductor device of the embodiment;

FIG. 10A to FIG. 10C are graphs explaining the function and the effectof the semiconductor device of the embodiment;

FIG. 11A shows schematic views in which FIG. 11A is a schematic view formagnetic field writing type MRAM and

FIG. 11B is a schematic view for a magnetic domain wall moving typeMRAM;

FIG. 12 is an example of a cross sectional view of an existentsemiconductor device; and

FIG. 13 is an example of a cross sectional view of an existentsemiconductor device.

DETAILED DESCRIPTION

The present invention is to be described by way of preferred embodimentswith reference to the drawings. Throughout the drawings, identicalconstituent elements carry the same references for which descriptionsmay be saved optionally.

First Embodiment

The present inventors have found the following points to be taken intoconsideration for attaining a logic-hybridized MRAM capable ofsatisfying that a process for forming a multilayered wiring for LSI doesnot fluctuate characteristics of the MRAM and the a process for formingMRAM does not fluctuate characteristics of the multilayered wiring.

(1) Logic IP and Device Parameters are Matched

That is, a multilayered wiring structure on the side of the logic, forexample, the height of a wiring layer, the height of a wirings and a viahole, or the material for them should not be changed by a MRAM formed inthe multilayered wiring. The device parameters are, for example, valuesof resistance and capacitance in the wiring layer. In the circuitdesign, design is performed generally based on the device parametersprovided from side of the device. When the depth of the via holeincreases, since the distance between upper and lower wirings changes itmay be a possibility this gives of an effect on the capacitance value orthe via hole resistance value between the upper and lower wirings. Whenthe resistance or the capacitance is displaced, there may be apossibility of resulting in troubles in the circuit operation due todisplacement of signal timing.

(2) Requirement for the Barrier Coating to MRAM

Due to diffusion and intrusion of Cu as the wiring material and moisturein the BEOL process into the MRAM region, characteristics of the MRAMmay be possibly deteriorated, or logic characteristics may bedeteriorated sometimes by the diffusion of metal element constitutingthe MRAM. Then, such disadvantages are overcome in this embodiment bycovering the MRAM with the barrier coating. Naturally, it is necessarythat the barrier coating does not change the multilayered wiringstructure or the material arrangement on the side of the logic.

Description is to be made on the embodiment satisfying the pointsdescribed above.

<Configuration of Semiconductor Device>

FIG. 1 shows an example of a cross sectional view of a semiconductordevice 100 in this embodiment. The illustrated semiconductor device 100has a CMOS logic region (second region) 101 and an MRAM cell region(first region) 102. The drawing shows an example in which a MRAM 103 isformed in the wiring layer A (second layer). In this embodiment, theheight of the wiring layer A in which the MRAM 103 is formed isidentical with the height of a wiring layer B in which the MRAM 103 isnot formed (first layer). Accordingly, in the CMOS logic region 101, theheight of a wiring (third wiring) 104 a and a via hole (third via hole)105 a formed in the wiring layer A is identical with the height of awiring (first wiring) 104 b and a via hole (first via hole) 105 b formedin the wiring layer B. “identical” means herein that there is nodifference exceeding the range of variation of manufacturing margin.This is identical also in the followings.

Then, FIG. 2A and FIG. 2B show enlarged cross sectional views extractinga main portion of the wiring layer A and the wiring layer B. FIG. 2Ashows the MRAM cell region 102 and FIG. 2B shows the CMOS logic region101.

As shown in FIG. 2A, an MRAM is formed in a wiring layer A of an MRAMcell region 102. The MRAM includes at least two first magnetizationpinning layers 50 a and 50 b in contact with a wiring 104 b of a wiringlayer B and insulated from each other, a free magnetization layer 10overlapping the two first magnetization pinning layers 50 a and 50 b ina plan view (for example, including the first magnetization pinninglayers 50 a and 50 b) and electrically connected with the firstmagnetization pinning layers 50 a and 50 b, a non-magnetic layer 40situated over the free magnetization layer 10, and a secondmagnetization pinning layer 60 situated over the non-magnetic layer. Thelateral side and the upper surface of the MRAM are covered with aprotective film 70. The wiring 104 b in contact with the firstmagnetization pinning layers 50 a and 50 b is connected with an externalcircuit.

For the first magnetization pinning layers 50 a and 50 b, an alloy of Ptand Co., a stacked film formed by alternately stacking Pt and Co., etc.are used. The ferromagnetic body used herein is not restricted to themand any ferromagnetic body may be used so long as magnetization can beprovided in the vertical direction. Further, conductive films 51 a and51 b containing Ta or Ti are disposed preferably as a barrier film forsuppressing diffusion of the ferromagnetic material at the lowermostlayer of the ferromagnetic body. The barrier film can be regarded as aportion of the magnetization pinning layer.

For the free magnetization layer 10, an alloy of Co and Ni, a stackedfilm formed by alternately stacking Co and Ni, etc. are used. Theferromagnetic body used herein is not restricted to them and anyferromagnetic body may be used so long as magnetization can be providedin the vertical direction. Further, it is necessary to insert a couplinglayer (not illustrated) between the free magnetization layer 10 and thefirst magnetization pinning layers 50 a and 50 b for ensuring theconductivity and coupling the magnetization of the first magnetizationpinned layers 50 a and 50 b to the free magnetization layer 10. For thecoupling layer, an alloy layer containing at least two or more ofelements of Pt, Co, Fe, Ni, and Ta, an amorphous magnetic filmcomprising CoNiB, CoFeB. CoFeZr, CoNiZr, NiFB, NiFeZr, etc., or astacked film thereof is used.

For the non-magnetic layer 40, insulators, semiconductors, metals, etc.can be used, and metal oxides, for example, MgO and AlO are usedpreferably.

For the second magnetization pinning layer 60, an alloy of Pt, Co, Ru,or a stacked film formed by optionally stacking Pt, Co, and Ru, etc. maybe used. The ferromagnetic body used herein is not restricted to thembut any ferromagnetic body may be used so long as vertical magnetizationcan be provided.

The protective film 70 comprises SiN, SiCN, or a stacked film thereof.While the protective film 70 preferably covers the lateral side and theupper surface of the MRAM as shown in FIG. 2A, a certain effect can beobtained so long as at least a portion of the lateral side and the uppersurface of the MRAM are covered.

The configuration of the MRAM of this embodiment described above isidentical with that of the MRAM described in International Laid-OpenPublication WO2009-001706. Accordingly, detailed descriptions for theaction, function, and the effect of the MRAM of this embodiment are tobe omitted.

As shown in FIG. 2B in the CMOS logic 101, the height of the wiring 104a and the via hole 105 a formed in the wiring layer A are identical withthe height of the wiring 104 b and via hole 105 b formed in the wiringlayer B.

<Method of Manufacturing a Semiconductor Device>

Then, an example of a method of manufacturing the semiconductor device100 of this embodiment as described above is to be described withreference to FIG. 3A to FIG. 3F, FIG. 4G to FIG. 4L, FIG. 5M to FIG. 5P,and FIG. 6Q to FIG. 6S. The drawings are cross sectional views showingthe flow of manufacturing the semiconductor device 100 of thisembodiment, in which an MRAM cell region 102 is formed on the left and aCMOS logic region 101 is formed on the right of the drawings.

At first, as shown in FIG. 3A, a via hole (first via hole) 105 b and awiring (first wiring) 104 b are formed in a first interlayer insulatingfilm 106 formed over a substrate (not illustrated) by utilizing a usualprocess for forming a multilayered wiring (dual damascene) process. Thedrawing shows a state in which Cu as the via hole (first via hole) 105 band the wiring (first wiring) 104 b are buried in a first interlayerinsulating film 106 and then planarized subsequently by CMP.

Then, as shown in FIG. 3B, a stacked cap film 107 is formed over thefirst interlayer insulating film 106 in which Cu is buried. The stackedcap film 107 comprises, for example, SiN (or SiCN) film 107 c/SiO₂ film107 b/SiCN film 107 a successively from above. Then, as shown in FIG.3C, the stacked cap film 107 of the MRAM cell region 102 is removed byphotolithography and dry etching to expose the wiring (first wiring) 104b formed in the MRAM cell region 102.

Then, as shown in FIG. 3D, one first magnetization pinning layer 50 a isformed over the entire surface of the substrate by a sputtering method.For example, an alloy of Pt and Co or a stacked film formed byalternately stacking Pt and Co is formed as the first magnetizationpinning layer 50 a.

Then, as shown in FIG. 3E, an SiN protective film 108 and an SiO₂ hardmask 109 are formed successively in this order over the firstmagnetization pinning layer 50 a and a resist pattern 110 covering aportion for leaving the first magnetization pinning layer 50 a is formedfurther thereover. Then, the SiO₂ hard mask 109, the SiN protective film108, and the first magnetization pinning layer 50 a are dry etched byusing the resist pattern 110 as a mask. Then, when the resist pattern110 and the SiO₂ hard mask 109 left after the dry etching are removed, astate as shown in FIG. 3(F) is obtained. In this step, the stacked capfilm 107 comprising the SiN (or SiCN) film 107 c/SiO₂ film 107 b/SiCNfilm 107 a is left in the CMOS logic region 101.

Then, as shown in FIG. 4G, another first magnetization pinning layer 50b is formed over the entire surface of the substrate by a sputteringmethod. As the first magnetization pinning layer 50 b, an alloy of Ptand Co, or a stacked film formed by alternately stacking Pt and Co, etc.formed in the same manner as in the one first magnetization pinninglayer 50 a is formed. For finally making the direction of magnetizationjust opposing to that of the one first magnetization pinning layer 50 a,while it is necessary to provide a difference in the magnetizationcoercive force, the difference can be provided in the magnetizationcoercive force, for example, by changing the film thickness, depositioncondition, etc.

Then, as shown in FIG. 4H, an SiN protective film 111 and an SiO₂ hardmask 112 are formed successively in this order over the firstmagnetization pinning layer 50 b, and a resist pattern 113 for coveringthe portion to leave the first magnetization pinning layer 50 b isformed thereover. Then, the SiO₂ hard mask 112, the SiN protective film111, and the first magnetization pinning layer 50 b are dry etched byusing the resist pattern 113 as a mask. Then, when the resist pattern113 and the SiO₂ hard mask 112 left after dry etching are removed, astate as shown in FIG. 4I is obtained. In this case, a stacked cap film107 comprising SiN (or SiCN) film 107 c/SiO₂ film 107 b/SiCN film 107 ais left in the CMOS logic region 101.

Then, after forming stacked film 114 comprising SiN and SiO₂ over theentire surface of the substrate in a state shown in FIG. 4I, CMP and dryetching are performed to expose the first magnetization pinning layers50 a and 50 b as shown in FIG. 4J. By the processing, the SiN (SiCN)film 107 c of the stacked film 107 is also removed. In this case, anextremely thin SiN film may be left on the surface. In this step, theextremely thin SiN film left in the sputtering chamber can be removed byAr sputtering or the like before subsequent forming of the freemagnetization layer.

Then, as shown in FIG. 4K, a free magnetization layer 10, a non-magneticlayer (tunnel barrier layer) 40, and a second magnetization pinninglayer 60 are formed in this order over the entire surface of thesubstrate by a sputtering method. Then, an SiN protective film 115 andan SiO₂ hard mask are formed in this order thereover, and a desiredresist pattern is formed further thereover. Then, the SiO₂ hard mask,the SiN protective film 115, the second magnetization pinning layer 60,the non-magnetic layer (tunnel barrier layer) 40, the free magnetizationlayer 10, and the stacked film 114 are dry etched by using the resistpattern as a mask. Then, when the resist pattern and the SiO₂ hard maskleft after the dry etching are removed, a state as shown in FIG. 4L isobtained. In this step, a laminate cap film 107 comprising SiO₂ film 107b/SiCN film 107 a is left in the CMOS logic region 101.

Then, after forming an SiN film 116 and an SiO₂ film 117 in this orderover the entire surface of the substrate in the state shown in FIG. 4L,when they are planarized by CMP, a state shown in FIG. 5M is obtained.Then, a resist pattern covering portion for removing the secondmagnetization pinning layer 60 is formed over the SiO₂ film 117. Then,the SiO₂ film 117, the SiN film 116, the SiN protective film 115, thesecond magnetization pinning layer 60, and the SiO₂ film 107 b are dryetched by using the resist pattern as a mask. The dry etching is stoppedat the non-magnetic layer (tunnel barrier layer) 40 and controlled so asnot to expose the free magnetization layer 10. Then, when the resistpattern and the SiO₂ film 117 left after the dry etching are removed, astate as show in FIG. 5N is obtained. In this step, a stacked cap film107 comprising the SiCN film 107 a is left in the CMOS logic region 101.

Then, as shown in FIG. 50, after forming a protective film 70comprising, for example, a SiCN film over the entire surface of thesubstrate, a second interlayer insulating film 118 is formed thereover.Then, when the second interlayer insulating film 118 is planarized byCMP, a state shown in FIG. 5P is obtained. The thickness of the secondinterlayer insulating film 118 after planarization is controlled so asto be identical with that of the first interlayer insulating film 106.

Then, as shown in FIGS. 6Q and 6R, after forming an SiO₂ hard mask 119over the second interlayer insulating film 118, via hole fabrication andwiring trench fabrication are performed in accordance with a usualwiring fabrication process. While an example of a via hole-firstfabrication process of at first fabricating a via hole is shown, thefabrication method is not restricted to the via hole-first process, buta trench-first process of at first fabricating the wiring trench patterncan also be used.

Then, when a barrier metal and Cu are buried in the wiring trench andthe via hole and excess Cu and the barrier metal are removed by CMP, alogic-matched wiring layer in which the MRAN is formed is formed asshown in FIG. 6S. According to the process, a via hole (second via hole)105 a electrically connected with the second magnetization pinning layer60 and a wiring (second wiring) 105 b electrically connected with thevia hole can be formed in the MRAM cell region 102, as well as a viahole (third via hole) 105 a electrically connected with the wiring(first wiring) 104 b and a wiring (third wiring) 105 b electricallyconnected with the via hole can be formed in the CMOS region 101 by theidentical processing.

In this embodiment, the MRAM is formed in contact with the wiring in thelower layer. That is, different from the existent technique shown inFIG. 13, the contact 8 (or via hole) is not situated between the wiringin the lower layer and the MRAM in this embodiment. According to theembodiment, since the thickness of the layer in which the MRAM is formedcan be reduced by so much as the contact 8 (or via hole) is notinterposed, the height of the layer can be made identical with theheight of the layer in which the MRAM is not formed. In this process,the height of the wiring and the via hole formed in each of the layerscan also be made identical. As a result, this can avoid disadvantagethat the multilayered wiring structure on the side of the logic ischanged by the MRAM formed in the multilayered wiring layer.

Usually, it is considered that the contact 8 (or via hole) is interposedbetween the lower wiring layer and the MRAM due to the reason, forexample, of suppressing corrosion of the wiring in the lower layer uponforming the MRAM device. In a case where the contact 8 (or via hole) isnot situated between the wiring in the lower layer and the MRAM,disadvantage such as corrosion of Cu may possibly be caused at thesurface of the lower layer wiring. Such disadvantage is avoided in thisembodiment by covering the surface of the lower wiring layer in thelogic region by using the stacked cap film 107.

Further, according to this embodiment, the material arrangement for themultilayered wiring on the side of the logic does not change due to theMRAM formed in the multilayered wiring layer.

Further, according to this embodiment, since the upper surface and thelateral side of the MRAM are covered with a film comprising SiCN, SiN ora stacked structure thereof having water proofness and Cu diffusionresistance, the stability of the MRAM is improved.

Second Embodiment <Configuration of Semiconductor Device>

FIGS. 7A and 7B show enlarged cross sectional views for extracted mainportion of a wiring layer A and a wiring layer B of the semiconductordevice of this embodiment. FIG. 7A shows an MRAM cell region and FIG. 7Bshows a CMOS logic region.

The semiconductor device of this embodiment is different from the firstembodiment in that a metal cap films 120 and 121 are present on thesurface of wirings 104 a and 104 b. Other configurations of asemiconductor device of this embodiment are identical with those in thefirst embodiment.

According to the semiconductor device of this embodiment, a metal capfilm 120 is situated between the wiring 104 b and first magnetizationpinning layers 50 a and 50 b. The metal cap film 120 can be, forexample, a Co-containing film, a W-containing film, or an Ru-containingfilm. Further, the thickness of the metal cap film 120 can be, forexample, 5 nm. The metal cap film 120 can function as a portion of thefirst magnetization pinning layers 50 a and 50 b.

<Method of Manufacturing Semiconductor Device>

Then, an example of a method of manufacturing the semiconductor deviceof this embodiment described above is to be described with reference toFIGS. 8A to 8C. The drawings are cross sectional views showing a flowfor manufacturing the semiconductor device of this embodiment in whichan MRAM cell region 102 is formed on the left and a CMOS logic region101 is formed on the right in the drawing.

At first, as shown in FIG. 8A, a via hole 105 b and a wiring 104 b areformed in a first interlayer insulating film 106 formed over a substrate(not illustrated) by a usual process for forming a multilayered wiring(dual damascene) process. The drawings show the state of burying Cu asthe via hole 105 b and the wiring 104 b in the first interlayerinsulating film 106 and then planarizing the same by CMP. Then, as shownin FIG. 8B, a metal cap film 120 is selectively formed over the wiring104 b by electroless plating or selective CVD.

Subsequently by performing the same processing as that explained for thefirst embodiment, a state shown in FIG. 8C is obtained. Then, a metalcap film 120 (not illustrated) is formed selectively over the wiring 104a by electroless plating or selective CVD.

According to this embodiment, the following function and effect can beobtained in addition to the function and effect of the first embodiment.

(1) According to this embodiment, when the wiring 104 b in the MRAM cellregion 102 is exposed by dry etching, since the surface of the wiring104 b is covered with the metal cap film 120, corrosion of the wiring104 b with an etching gas or peeling liquid can be suppressed.(2) Further, according to this embodiment, electron migration (EM)resistance of the wirings 104 a and 104 b can be improved remarkably byforming the metal cap films 120 and 121 over the wirings 104 a and 104b.

FIG. 9 is a graph showing the cumulative failure rate of disconnectionfailure of copper-containing wirings just below the via hole due to EMunder the reference conditions of not using the metal cap films 120 and121 and conditions of using the metal cap films 120 and 121respectively. As can be seen from the graph, EM resistance is improvedas much as by 6,000 times by using the metal cap films 120 and 121.

In the MRAM, EM-induced wiring disconnection is caused by write currentby which the writing cycles to the MRAM may possibly be restricted.According to this embodiment, since the metal cap films 120 and 121 areformed over the wirings 104 a and 104 b, the EM resistance of the wiringcan be improved and, as a result, restriction to the writing cycles canbe overcome.

(3) Further, according to this embodiment, the EM resistance of thewirings 104 a and 104 b is improved remarkably and formation of voids inthe wiring due to write current can be suppressed to enable RAMoperation.

FIGS. 10A to 10C show the advantageous effect when applying the metalcaps 120 and 121 to the writing wirings of MRAM. FIG. 11A is a schematicview of a magnetic field writing type and FIG. 11B shows a schematicview of a magnetic domain wall moving type. In the magnetic fieldwriting type of switching spin (reversal) of MTJ (Magnetic TunnelJunction) depending on the direction of the magnetic field, a largercurrent is necessary compared with that of the magnetic domain wallmoving type.

FIG. 10A shows the dependence of the write cycle on operationtemperature by EM rate determination in the writing wiring in a case ofapplying a write current at 1 mA for 30 nsec assuming the magnetic fieldwriting type for the case of presence or absence of a metal cap. In thegraph “reference” shows data corresponding to the absence of metal cap.This presumption is identical also for FIGS. 10B and 10C.

FIG. 10B shows the dependence of the writing cycle on operationtemperature in a case of applying a write current at 0.2 mA for 40 nsecassuming the magnetic domain wall type for the case of presence orabsence of a metal cap. FIG. 10C shows the writing cycles at 210° C. foreach of the magnetic field writing type and the magnetic domain wallmoving type respectively.

As can be seen from FIGS. 10A and 10C, writing cycle of 1×E¹⁶ times ofDRAM cannot be attained in the magnetic field writing type of largewrite current under the condition of not using the metal cap. However,when the metal cap is used, as shown in FIG. 10A, the writing cycle of1×E¹⁶ times of DRAM can be attained as shown in FIG. 10A. Further, whenthe metal cap is used, a writing cycle of 1×E¹⁶ times of DRAM can beattained as shown in FIG. 10C even at a high temperature circumferenceof 210° C.

As can be seen from FIGS. 10B and 10C, in the magnetic domain wallmoving type, DRAM writing cycles of 1×10¹⁶ times cannot be attained whenthe operation temperature exceeds about 100° C. under the conditions ofnot using the metal cap. However, as shown in FIG. 10B, the DRAM writingcycles of 1×10¹⁶ times can be attained when the metal cap is used.Further, as shown in FIG. 10C, the DRAM writing cycles of 1×E¹⁶ timescan be attained even in a high temperature circumstance of 210° C. whenthe metal cap is used.

As described above, restriction on the writing cycles due to the EM ratedetermination can be eliminated by applying the metal cap to the writingwiring, and the RAM operation is possible even at a high temperature of210° C. and application to a high temperature circumstance such as incar-mounted microcomputers can be expected.

(4) Further, according to the method of manufacturing the semiconductordevice of this embodiment, disadvantage caused by temperature loweringof the wiring process can be moderated.

That is, due to lowering of density, etc. along with temperaturelowering of the wiring process, the interlayer insulating film tends toabsorb moisture to result in a possibility that the wiring tends toundergo corrosion. According to this embodiment, such disadvantage canbe moderated by the presence of the metal cap.

Third Embodiment <Configuration of Semiconductor Device>

The configuration of the semiconductor device of this embodiment isidentical with that of the first embodiment or the second embodiment,excepting that the interlayer insulating film is an SiOCH film and thecompositional ratio represented by C/Si is 1 or more and 10 or less.

<Method of Manufacturing Semiconductor Device>

The method of manufacturing the semiconductor device according to thisembodiment is identical with that of the first embodiment or the secondembodiment except for forming the interlayer insulating film by plasmapolymerizing reaction by using a starting material having a cyclicorganic silica structure represented by the following formula (I).

As means for forming a low-k insulating film, it may be considered meansof forming a porous insulating layer by evaporating a substance buriedin the insulating layer by heating and forming voids in the insulatinglayer. However, such means requires a temperature for the heating of400° C. or higher. Since the heating resistance of MRAM is defined as350° C. or lower, the characteristics of the MRAM may possibly bedegraded when the means is adopted.

According to the configuration of this embodiment, since the low-kinsulating layer can be formed at 300° C. or lower, this embodiment cansuppress the disadvantage when the MRAM is exposed to a temperature of350° C. or higher and can suppress disadvantages such as degradation ofcharacteristic due to thermal hysteresis and, as a result, improve thestability of the MRAM.

Further, according to this embodiment, since the average void diameterin the interlayer insulating film can be as fine as 0.3 nm or more and0.7 nm or less, and a structure in which individual voids areindependent of each other tends to be attained, diffusion of gas,moisture, metal, etc. into the interlayer insulating film is suppressed.Accordingly, a multilayered wiring and MRAM at high reliability can beobtained.

Further, according to this embodiment, since the concentration of C ishigh in the interlayer insulating film formed of the SiOCH film as thecompositional ratio represented by C/Si is 1 or greater, high resistanceto the plasma treatment during process can be attained, so that thecapacitance fluctuation in the wiring is small and stable wiringperformance and high yield can be attained.

1. A semiconductor device having a multilayered wiring layer formed overa substrate, wherein a first layer contained in the multilayered wiringlayer has: a first interlayer insulating film; and a plurality of firstvia holes buried in the first interlayer insulating film, and aplurality of first wirings buried in the first interlayer insulatingfilm, connected with the first via holes, and exposed at the surfacefrom the first interlayer insulating film, and wherein a second layercontained in the multilayered wiring layer and situated just over has,in a first region, an MRAM (magnetoresistive random access memory)having at least two first magnetization pinning layers in contact withthe first wiring and insulated from each other, a free magnetizationlayer overlapping the two first magnetization pinning layer in a planview and connected with the first magnetization pinning layers, anon-magnetic layer situated over the free magnetization layer, and asecond magnetization pinning layers situated over the non-magneticlayer; a second interlayer insulating film covering the MRAM; a secondvia hole buried in the second interlayer insulating film and connectedwith the second magnetization pinning layers; and a second wiring buriedin the second interlayer insulating film, connected with the second viahole, and exposed at the surface from the second interlayer insulatingfilm.
 2. The semiconductor device according to claim 1, wherein theheight of the first layer and the height of the second layer areidentical.
 3. The semiconductor device according to claim 1, wherein theMRAM is not situated in a second region of the second layer, and thesecond interlayer insulating film formed over the first layer, a thirdvia hole buried in the second interlayer insulating film and connectedwith the first wiring, and a third wiring buried in the secondinterlayer insulating film and connected with the third via hole aresituated in the second region of the second layer.
 4. The semiconductordevice according to claim 1, wherein the device further has a protectivefilm covering the MRAM, and wherein the protective film comprises an SiNfilm, an SiCN film, or a stacked film comprising the same.
 5. Thesemiconductor device according to claim 4, wherein the protective filmcovers the upper surface and the lateral side of the MRAM.
 6. Thesemiconductor device according to claim 4, wherein the protective filmextends in the second region of the second layer and situated betweenthe first layer and the second interlayer insulating film.
 7. Thesemiconductor device according to claim 1, wherein the exposed surfaceof the first and the second wirings is covered with the metal cap film.8. The semiconductor device according to claim 7, wherein the metal capfilm covering the first wiring forms a portion of the MRAM.
 9. Thesemiconductor device according to claim 1, wherein the first and thesecond interlayer insulating films comprises SiCOH.
 10. Thesemiconductor device according to claim 9, wherein the first and thesecond interlayer insulating film comprising SiCOH have a C/Si ratio of1 or more and less than
 10. 11. A method of manufacturing asemiconductor device comprising: a first step of forming a firstinterlayer insulating film over a substrate and then burying a pluralityof first via holes and first wirings in the first interlayer insulatingfilm so as to expose the first wirings thereby forming a first layer, asecond step of forming at least two first magnetization pinning layerselectrically insulated from each other over the first wiring in a firstregion over the first layer, a third step of completing an MRAM byforming a free magnetization layer overlapping the two firstmagnetization pinning layer in a plan view, and electrically connectedwith the first magnetization pinning layers, a non-magnetic layersituated over the free magnetization layer, and a second magnetizationpinning layers situated over the non-magnetic layer, a fourth step offorming a second interlayer insulating film covering the MRAM, and afifth step of burying a second via hole connected with the secondmagnetization pinning layer and a second wiring connected with thesecond via hole in the second interlayer insulating film.
 12. The methodof manufacturing a semiconductor device according to claim 11, furthercomprising: a step of forming a protective film comprising an SiN film,a SiCN film, or a stacked film comprising the same so as to cover theMRAM after the third step and before the fourth step.
 13. The method ofmanufacturing a semiconductor device according to claim 11, wherein thesecond interlayer insulating film is formed over the second region overthe first layer in the fourth step, and wherein a third via holeconnected with the first wiring and a third via hole connected with thethird via hole are buried in the second interlayer insulating film inthe second region by the identical processing of forming the second viahole and second wiring in the fifth step.
 14. The method ofmanufacturing a semiconductor device according to claim 11, wherein thefirst and the second interlayer insulating 1 films are formed by plasmapolymerizing reaction using a starting material having a cyclic organicsilica structure represented by the following formula (I):


15. The method of manufacturing a semiconductor device according toclaim 11, comprising: a step of forming a mask film covering the firstwiring exposed in the region where the MRAM is not formed after thefirst step and before the second step.
 16. The method of manufacturing asemiconductor device according to claim 15, wherein the mask filmcomprises an SiN film or a SiCN film, or a stacked film formed bystacking the SiO₂ film and the SiCN film orderly from above.